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16 December 2009 year (time zone GMT 00:00)  Number of sources in English: 4957
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Chinese processor drives $99 netbook, say reports

16.12.2009 18:05    eetimes.com
Recently formed Cherrypal (Palo Alto, Calif. and Hong Kong, China) has launched a netbook computer priced at $99 that, according to reports, is powered by a processor from Ingenic Semiconductor Co. Ltd. (Beijing, China).
Chinese processor drives $99 netbook, say reports


European biometrics market booming, says analyst

16.12.2009 18:05    eetimes.com
Biometrics in the EMEA region (Europe, Middle East and Africa) earned 216.1 million euro in 2008 (about $300 million) and is anticipated to reach 1,058.0 million euro by 2015 (about $1.5 billion), according to market research firm Frost & Sullivan.
European biometrics market booming, says analyst

German research project aims for more flexible and secure automated manufacturing

16.12.2009 18:05    eetimes.com
The SANITAS research project launched under the management of Infineon includes nine partners, research institutes and companies from the semiconductor, automotive and industrial automation sectors.
German research project aims for more flexible and secure automated manufacturing

Tapping the Internet behind wheels

16.12.2009 18:04    eetimes.com
iSuppli estimates about 62.3 million consumers will have Internet access in their cars by 2016, up from 970,000 at the end of 2009.
Tapping the Internet behind wheels


RoodMicrotec, X-Fab collaboration eases data access

16.12.2009 18:04    eetimes.com
Rood Testhouse International N.V. (RoodMicrotec) has signed a collaboration agreement with analog/mixed-signal foundry, X-FAB.
RoodMicrotec, X-Fab collaboration eases data access

Lightweight Markup Languages

16.12.2009 18:02    webreference.com
are markup languages designed with an honest attempt to make them simple enough for non-programmers to read and write in them. There are several lightweight markup languages available on the internet. Arpan Dhandhania shows you how to use the two
Lightweight Markup Languages

Organic and printed electronics roadmap

16.12.2009 18:02    eetimes.com
The Organic Electronics Association (OE-A) has just released a 80-page roadmap for organic and printed electronics, available for download from the OE-A homepage.
Organic and printed electronics roadmap

Broadcom taps 40-nm process for high-def handsets

16.12.2009 07:22    eetimes.com
Broadcom Corp. is sampling its first 40 nm chip, a cellphone media processor capable of recording full 1080-progressive high definition video, the company said at its annual meeting with Wall Street analysts where it positioned itself as poised for a
Broadcom taps 40-nm process for high-def handsets

Comneon launches GSM-to-HSPA+ protocol stack

16.12.2009 07:22    eetimes.com
Comneon GmbH (Nuremburg, Germany), a subsidiary of Infineon Technologies AG, has announced a protocol stack supporting GSM, GPRS, EDGE and EDGE Evolution as well as FDD WCDMA with HSDPA, HSUPA and HSPA+.
Comneon launches GSM-to-HSPA+ protocol stack

Nemotek can test wafer-level cameras

16.12.2009 07:22    eetimes.com
By announcing in-house testing capabilities, Nemotek Technologie brings wafer-level cameras (WLCs) design, manufacturing and now testing under one roof, simplifying the supply chain process and costs for image sensor and camera module makers.
Nemotek can test wafer-level cameras

EVE's emulator provides multi-user capability

16.12.2009 07:21    eetimes.com
EVE SA (Palaiseau, France) said it has enhanced its ZeBu-Server emulation system by supporting up to 25 users concurrently, with automatic allocation of available resources.
EVE's emulator provides multi-user capability

Presented By:

16.12.2009 07:20    eetimes.com
Presented By:

Machines make 4.3% of U.S. mobile calls, says analyst

16.12.2009 07:19    eetimes.com
In 2009 machine-to-machine (M2M) calls accounted for 1.4 percent of mobile network connections worldwide, according to analysis firm Berg Insight AB (Gothenburg, Sweden).
Machines make 4.3% of U.S. mobile calls, says analyst

ST-Ericsson demonstrates LTE, HSPA handover

16.12.2009 07:19    eetimes.com
Wireless chip company ST-Ericsson NV (Geneva, Switzerland) has demonstrated handover between LTE and HSPA networks using multimode LTE/HSPA silicon.
ST-Ericsson demonstrates LTE, HSPA handover

Toshiba samples 64-Gbyte NAND module

16.12.2009 07:18    eetimes.com
Toshiba Corp. has a launched a 64-Gbyte NAND flash memory module that complies with the e-MMC standard. Presented By:
Toshiba samples 64-Gbyte NAND module

CoWare joins ARM Solution Center for Android

16.12.2009 07:17    eetimes.com
EDA group CoWare Inc. (San Jose, Calif.) has become a participating partner of the ARM Solution Center for Android, a collaborative resource for designers and developers of ARM technology-based products running on Android, the open source platform from the Open
CoWare joins ARM Solution Center for Android

TSMC develops LED driving manufacturing process

16.12.2009 07:16    eetimes.com
Taiwan Semiconductor Manufacturing Company (TSMC) announced modular bipolar, CMOS DMOS (BCD) process technologies targeting high voltage integrated LED driver devices.
TSMC develops LED driving manufacturing process

Altos unveils statistical memory characterization tool

16.12.2009 07:16    eetimes.com
Library characterization startup Altos Design Automation Inc. has introduced Variety MX that it claims is a fast and accurate statistical timing model generator for embedded memories.
Altos unveils statistical memory characterization tool

Thales, Tronics partner on inertial MEMS

16.12.2009 07:15    eetimes.com
Tronics Microsystems and Thales have signed a strategic supply agreement within the field of navigation systems, whereby Tronics will produce high-performance, vacuum-packaged inertial MEMS-sensing elements based on two design concepts that Thales invented.
Thales, Tronics partner on inertial MEMS

NEC, Renesas sign deal to merge in 2010

16.12.2009 07:14    eetimes.com
NEC Electronics Corp. and Renesas Technology Corp. have moved their merger agreement forward by signing a deal to integrate business operations at NEC Electronics and Renesas on April 1, 2010.
NEC, Renesas sign deal to merge in 2010

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