In what could shake-up the market, Applied Materials Inc. has made its expected entry into the photomask inspection business, by rolling out a new tool based on a breakthrough aerial imaging technology.
Some of the world's biggest hitters in the mobile communications equipment sector have joined forces to establish rules for licensing patents related to Long Term Evolution (LTE) technology.
Ramtron International Corp. has unveiled what it claims is the first in a new family of intelligent ferroelectric RAMs capable of recording data independent of a separate microcontroller previously needed to make the nonvolatile memory operate like solid-state storage devices.
Embedded devices vendor Via Technologies announced to expand its embedded board portfolio to include modules compliant to the COM Express industry standard. With its offer, the company addresses large OEMs only.
Bristol University physicists advance the field of quantum computing with the successful miniaturization of a high-performance, optical "controlled-NOT gate."
China's Trina Solar Ltd., a manufacturer of solar photovoltaic products from the production of ingots, wafers, cells and modules, has discontinued the development of its previously- announced $1 billion polysilicon production facility.
Carlyle-controlled Japanese handy-phone firm Willcom Inc. rolled out the world's first phones featuring Intel Corp's Centrino Atom microprocessors, as it fights for new users in a saturated market.
An engineering search engine is launching a supplier index tailored to engineers that is designed to measure online demand for technical data on electronic components.
IBM and its partners in the race to develop and ship high-k dielectrics and metal gates for the 32-nm node have officially revealed their process and are claiming they can now outperform the rest of the industry in performance and
TechOnline's Greg Quirk went inside the Garmin nuvi 750 and HP iPaq 310 GPS navigation systems to find that while they did have some crossover in terms of components, such as the use of chips from SiRF and Wolfson, they
The "NewCo" being formed by ST Microelectronics and NXP Semiconductors that will merger the companies' wireless chip activities is likely to face major challenges, according to an analysis by Gartner Dataquest. And create big issues for its main competitors.
Wireless chip specialist CSR plc (Cambridge, England), together with the Bluetooth Specialist Interest Group and Nokia, have for the first time demonstrated the Ultra Low Power (ULP) Bluetooth in silicon.
